DELL Pro QCT1255 AMD Ryzen™ 7 8700G 16 GB DDR5-SDRAM 512 GB SSD Windows 11 Pro Tower PC Black

DELL Pro QCT1255 AMD Ryzen™ 7 8700G 16 GB DDR5-SDRAM 512 GB SSD Windows 11 Pro Tower PC Black

  • Brand: DELL
  • Category:
  • SKU: JXGHR
  • EAN: 5397184978382
DELL Pro QCT1255, 4.2 GHz, AMD Ryzen™ 7, 8700G, 16 GB, 512 GB, Windows 11 Pro

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Description

DELL Pro QCT1255. Processor frequency: 4.2 GHz, Processor family: AMD Ryzen™ 7, Processor model: 8700G. Internal memory: 16 GB, Internal memory type: DDR5-SDRAM. Total storage capacity: 512 GB, Storage media: SSD. On-board graphics card model: AMD Radeon 780M. Operating system installed: Windows 11 Pro, Operating system architecture: 64-bit. Power supply: 180 W. Chassis type: Tower. Product type: PC. Weight: 6.76 kg. Product colour: Black

Specifications

Processor
Processor generationAMD Ryzen 8000 Series
Processor cache typeL3
Processor cache16 MB
Processor frequency4.2 GHz
Processor model8700G
Number of processors installed1
Processor manufacturerAMD
Processor boost frequency5.1 GHz
Processor threads16
Processor cores8
Processor familyAMD Ryzen™ 7
Processor base power65 W
Neural processor unit (NPU)
NPU performance up to16 TOPs
Memory
Non-ECCYes
Memory layout (slots x size)1 x 16 GB
Internal memory16 GB
Maximum internal memory64 GB
Memory slots2x DIMM
Internal memory typeDDR5-SDRAM
Memory channelsDual-channel
Memory data transfer rate4800 MT/s
Storage
Storage mediaSSD
Number of storage drives installed1
Optical drive typeNo
SSD interfacePCI Express
SSD capacity512 GB
Number of SSDs installed1
Total storage capacity512 GB
SSD memory typeTLC
SSD form factorM.2
Total SSDs capacity512 GB
NVMeYes
Graphics
Discrete graphics cardNo
On-board graphics card familyAMD Radeon
On-board graphics cardYes
Discrete graphics card modelNot available
On-board graphics card modelAMD Radeon 780M
On-board GPU manufacturerAMD
Performance
Product typePC
Trusted Platform Module (TPM)Yes
Motherboard chipsetAMD PRO 665
Trusted Platform Module (TPM) version2.0
Audio chipRealtek ALC3204
Audio systemHigh Definition Audio
Optical drive
Optical drive typeNo
Network
Ethernet LANYes
Wi-FiNo
Ethernet LAN data rates10,100,1000 Mbit/s
Cabling technology10/100/1000Base-T(X)
Ports & interfaces
Combo headphone/mic portYes
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity3
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity1
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity0
USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity0
Thunderbolt 3 ports quantity0
HDMI version2.1
USB 2.0 ports quantity4
HDMI ports quantity1
Ethernet LAN (RJ-45) ports1
DisplayPorts quantity1
PowerShareYes
Number of USB ports with PowerShare support2
DisplayPort version1.4a
Power
80 PLUS certification80 PLUS Bronze
Power supply input frequency47/63 Hz
Power supply input voltage90 - 264 V
Power supply180 W
Technical details
Cable lock slot typeKensington
Product typePC
Trusted Platform Module (TPM)Yes
Product colourBlack
Chassis typeTower
Audio systemHigh Definition Audio
Cable lock slotYes
Motherboard chipsetAMD PRO 665
Doesn't containPVC/BFR
Design
Cable lock slot typeKensington
Product colourBlack
Chassis typeTower
Cable lock slotYes
Software
Operating system architecture64-bit
Trial softwareActivate Your Microsoft 365 For A 30 Day Trial
Operating system installedWindows 11 Pro
Display
Display includedNo
Audio
Audio chipRealtek ALC3204
Audio systemHigh Definition Audio
Operational conditions
Operating altitude-15.2 - 3048 m
Storage temperature (T-T)-40 - 65 °C
Operating relative humidity (H-H)20 - 80%
Storage relative humidity (H-H)5 - 95%
Operating temperature (T-T)10 - 35 °C
Non-operating altitude-15.2 - 10668 m
Operating vibration0.26 G
Non-operating vibration1.37 G
Operating shock40 G
Non-operating shock105 G
Sustainability
Total carbon footprint (kg of CO2e)196
Doesn't containPVC/BFR
Weight & dimensions
Width154 mm
Depth293 mm
Height324.3 mm
Weight6.76 kg
Packaging content
Display includedNo
Carbon footprint
Total carbon footprint (kg of CO2e)196
PAIA versionGaBi version 1, 2024
Carbon emissions, energy usage (kg of CO2e)68.6
Carbon emissions, manufacturing (kg of CO2e)106.82
Carbon emissions, logistics (kg of CO2e)12.74
Carbon emissions, end-of-life (kg of CO2e)7.84
Other features
Trusted Platform Module (TPM)Yes
On-board graphics cardYes
Processor manufacturerAMD
Doesn't containPVC/BFR