HPE Xeon Intel -Gold 5317 3.0GHz 12-core 150W Processor Kit for ProLiant XL2x0n Gen10 Plus
- Brand: HPE
- Category:
- SKU: P36806-B21
- EAN: 0190017497518
Intel Xeon-Gold 5317 3.0GHz 12-core 150W Processor Kit for HPE ProLiant XL2x0n Gen10 Plus
Offer details
Trade Prices
| Distributor | Product | SKU | Stock | Updated | Price |
|---|---|---|---|---|---|
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Xeon Gold 5317 processor 3 |
P36806-B21 | |||
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INT XEON-G 5317 KIT FOR XL2X0N GEN10 View on Webshop |
P36806-B21 | |||
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Intel Xeon-Gold 5317 3.0 GHz 12-core 150 W XL2x0n G10+ |
P36806-B21 |
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Description
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Specifications
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3 GHz |
| Processor manufacturer | Intel |
| Thermal Design Power (TDP) | 150 W |
| Processor cache | 18 MB |
| Processor model | 5317 |
| Processor threads | 24 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.6 GHz |
| Processor lithography | 10 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 12 |
| Processor socket | LGA 4189 |
| Processor series | Intel Xeon Gold 5000 Series |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 150 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| PCI Express slots version | 4.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 150 W |
| Processor series | Intel Xeon Gold 5000 Series |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 150 W |
| PCI Express slots version | 4.0 |
| Scalability | 2S |
| Market segment | Server |
| Processor special features | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Weight & dimensions | |
| Width | 174.8 mm |
| Weight | 700 g |
| Height | 169.7 mm |
| Depth | 285.7 mm |