HPE Intel Xeon-Silver 4210R (2.4GHz/10-core/100W) Processor Kit for ProLiant DL360 Gen10, 15 in distributor/wholesale stock for resellers to sell

HPE Intel Xeon-Silver 4210R (2.4GHz/10-core/100W) Processor Kit for ProLiant DL360 Gen10

Intel Xeon-Silver 4210R (2.4GHz/10-core/100W) Processor Kit for HPE ProLiant DL360 Gen10

Product	SKU	Stock
DL360 Gen10 4210R Kit	P15974-B21	Register free see stock
Intel Xeon Silver 4210R - 2.4 GHz - 10-core - 13.75 MB cache - for Nimble Storage dHCI Small Solution with HPE ProLiant DL360 Gen10, ProLiant DL360 Gen10 View on InTouch open_in_new	5669444
INTEL XEON-S 4210R KIT FOR DL360 GEN View on Webshop open_in_new	P15974-B21
DL360 Gen10 Intel Xeon-Silver 4210R 10-Core (2.40GHz 13.75MB L3 Cache) Processor Kit	P15974-B21
Processor Kit for HPE ProLiant DL360 Gen10 - Intel Xeon Silver 4210R / 2.4GHz - 10 Core - 14MB Cache - 100W	P15974B21

Alternative Suppliers
	INTEL XEON-S 4210R KIT FOR DL360 GEN	CLP15974-B21	Register free see stock

Merchant	Condition	Price
Amazon	New	£648.98
Amazon	New	£668.47
Amazon	New	£1,330.00
Amazon	New	£838.26
Amazon	New	£620.47

Processor
Processor generation	2nd Generation Intel® Xeon® Scalable
Processor base frequency	2.4 GHz
Processor manufacturer	Intel
Cooler included	No
Processor codename	Cascade Lake
Thermal Design Power (TDP)	100 W
Processor cache	13.75 MB
Processor model	4210R
Processor threads	20
System bus rate	9.6 GT/s
Processor operating modes	64-bit
Processor boost frequency	3.2 GHz
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel Xeon Silver
Processor cores	10
Processor socket	LGA 3647 (Socket P)
Processor cache type	L3
Package type	Tray
Memory
Maximum internal memory supported by processor	1.02 TB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2400 MHz
Memory channels	Hexa-channel
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	100 W
Technical details
PCI Express slots version	3.0
Scalability	2S
Thermal Design Power (TDP)	100 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	100 W
PCI Express slots version	3.0
Scalability	2S
Market segment	Server
Harmonized System (HS) code	85423119
Packaging data
Package type	Tray
Logistics data
Harmonized System (HS) code	85423119
Weight & dimensions
Width	88.9 mm
Weight	540 g
Height	25.4 mm
Depth	108 mm