HPE Intel Xeon-Gold 6226R (2.9GHz/16-core/150W) Processor Kit for ProLiant DL360 Gen10, 2 in distributor/wholesale stock for resellers to sell

HPE Intel Xeon-Gold 6226R (2.9GHz/16-core/150W) Processor Kit for ProLiant DL360 Gen10

Intel Xeon-Gold 6226R (2.9GHz/16-core/150W) Processor Kit for HPE ProLiant DL360 Gen10

Distributor	Product	SKU	Stock
	DL360 Gen10 6226R Kit	P24481-B21	Register free see stock
	DL360 GEN10 6226R KIT STOCK View on Xvantage open_in_new	2M2SUW7
	Intel Xeon Gold 6226R - 2.9 GHz - 16-core - 22 MB cache - for Nimble Storage dHCI Small Solution with HPE ProLiant DL360 Gen10, ProLiant DL360 Gen10 View on InTouch open_in_new	5669478
	INTEL XEON-G 6226R KIT FOR DL360 GEN View on Webshop open_in_new	P24481-B21
	HPE DL360 GEN10 6226R KIT	P24481-B21
Ingram Micro CS	DL360 GEN10 6226R KIT STOCK	2M2SUW7
	HPE Intel Xeon Gold (2nd Gen) 6226R Hexadeca-core (16 Core) 2.90 GHz Processor Upgrade	STD10020897

Alternative Suppliers
	INTEL XEON-G 6226R KIT FOR DL360 GEN	CLP24481-B21	Register free see stock

Merchant	Product	Condition	Updated	Price
Amazon		New		£4,633.34

Processor
Processor generation	2nd Generation Intel® Xeon® Scalable
Processor base frequency	2.9 GHz
Processor manufacturer	Intel
Cooler included	No
Processor codename	Cascade Lake
Thermal Design Power (TDP)	150 W
Processor cache	22 MB
Processor model	6226R
Processor threads	32
System bus rate	10.4 GT/s
Processor operating modes	64-bit
Processor boost frequency	3.9 GHz
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel® Xeon® Gold
Processor cores	16
Processor socket	LGA 3647 (Socket P)
Processor cache type	L3
Package type	Tray
Memory
Maximum internal memory supported by processor	1.02 TB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2933 MHz
Memory channels	Hexa-channel
ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	150 W
Technical details
PCI Express slots version	3.0
Scalability	2S
Thermal Design Power (TDP)	150 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	150 W
PCI Express slots version	3.0
Scalability	2S
Market segment	Server
Harmonized System (HS) code	85423119
Packaging data
Package type	Tray
Logistics data
Harmonized System (HS) code	85423119
Weight & dimensions
Width	88.9 mm
Weight	540 g
Height	25.4 mm
Depth	108 mm