HPE Intel Xeon-Gold 5220R (2.2GHz/24-core/150W) Processor Kit for ProLiant DL360 Gen10, 9876 in distributor/wholesale stock for resellers to sell

HPE Intel Xeon-Gold 5220R (2.2GHz/24-core/150W) Processor Kit for ProLiant DL360 Gen10

Intel Xeon-Gold 5220R (2.2GHz/24-core/150W) Processor Kit for HPE ProLiant DL360 Gen10

Distributor	Product	SKU	Stock
	DL360 Gen10 5220R Kit	P15995-B21	Register free see stock
	INTEL XEON-G 5220R KIT FOR View on Xvantage open_in_new	2M2SUW5
	Intel Xeon Gold 5220R - 2.2 GHz - 24-core - 35.75 MB cache - for Nimble Storage dHCI Small Solution with HPE ProLiant DL360 Gen10, ProLiant DL360 Gen10 View on InTouch open_in_new	5669446
	INTEL XEON-G 5220R KIT FOR DL360 GEN View on Webshop open_in_new	P15995-B21
	Intel Xeon Gold 5220R - 2.2 GHz - 24-core - 35.75 MB cache - for Nimble Storage dHCI Small Solution with HPE ProLiant DL360 Gen10; ProLiant DL360 Gen10	P15995-B21
Ingram Micro CS	INTEL XEON-G 5220R KIT FOR	2M2SUW5

Alternative Suppliers
	INTEL XEON-G 5220R KIT FOR DL360 GEN	CLP15995-B21	Register free see stock

Merchant	Product	Condition	Updated	Price
Amazon		New		£3,862.38
Amazon		New		£2,184.96

Processor
Processor generation	2nd Generation Intel® Xeon® Scalable
Processor base frequency	2.2 GHz
Processor manufacturer	Intel
Cooler included	No
Processor codename	Cascade Lake
Thermal Design Power (TDP)	150 W
Processor cache	35.75 MB
Processor model	5220R
Processor threads	48
System bus rate	10.4 GT/s
Processor operating modes	64-bit
Processor boost frequency	4 GHz
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel® Xeon® Gold
Processor cores	24
Processor socket	LGA 3647 (Socket P)
Processor cache type	L3
Package type	Tray
Memory
Maximum internal memory supported by processor	1.02 TB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2667 MHz
Memory channels	Hexa-channel
ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	150 W
Technical details
PCI Express slots version	3.0
Scalability	2S
Thermal Design Power (TDP)	150 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	150 W
PCI Express slots version	3.0
Scalability	2S
Market segment	Server
Harmonized System (HS) code	85423119
Packaging data
Package type	Tray
Logistics data
Harmonized System (HS) code	85423119
Weight & dimensions
Width	88.9 mm
Weight	540 g
Height	25.4 mm
Depth	108 mm